LED cooling core contention: who has better heat dissipation performance on aluminum substrate and ceramic substrate?
addDate:2018-05-18 From:YiLiHua Keywords:YiLiHua Views:2195
On May 3, Osram, the German lighting giant, released its second-quarter results for fiscal year 2017, with revenue of 1.05 billion euros ($7.897 billion) in January-March 2017, an increase of about 10% over the same period last year. In the rapid development of semiconductor lighting today, LED's key problem - heat dissipation, will become a big problem, then how on earth can the most efficient heat dissipation? Today we are going to talk about the chip of LED.
Now chip manufacturing is varied, and LED chips are no exception. The thermal conductivity of the chip will directly affect the heat dissipation, of course, as a chip can not only look at the heat dissipation, but also dielectric constant, thermal expansion coefficient and so on. Today, a wide range of aluminum substrates and low-lying ceramic substrates are widely used in the market.
Aluminum substrates - commonly used in LED lighting products. There are positive and negative sides, the white side is welded LED pins, the other side presents the aluminum color, will generally be coated with heat conduction slurry after contact with the heat conduction part.
Aluminum substrate commonly used metal aluminum-based sheets are mainly 1000 series, 5000 Series and 6000 series, the basic characteristics of these three series of aluminum are as follows:
1, 1000 series represents 1050, 1060, 1070, 1000 series of aluminum plates, also known as pure aluminum plate, in all series of 1000 series belong to the most aluminum content, purity can reach 99.00%. Because it does not contain other technical elements, so the production process is relatively simple, relatively cheap, is the most commonly used in conventional industry in a series.
The 2 and 5000 Series represent 5052, 5005, 5083 and 5A05 series. The 5000 series aluminum sheets belong to the more commonly used series of alloy aluminum sheets, the main element is magnesium, magnesium content is between 3-5%, which is also known as aluminum magnesium alloy. The main features are low density, high tensile strength and high elongation. Aluminum-magnesium alloys are often used in aviation, such as aircraft fuel tanks, because they weigh less than other series in the same area.
Series 3 and 6000 represent 6061, which mainly contains magnesium and silicon. Therefore, Series 4000 and Series 5000 have the advantages that 6061 is a cold-treated aluminum forging product. It is suitable for the application of high corrosion resistance and oxidation resistance. It has good usability, excellent interface features, easy coating and good processability.
The thermal conductivity of 5000 series aluminum substrate is about 135W / (m K), 6000 series aluminum substrate is about 150W / (m K) and 1000 series aluminum substrate is about 220W / (m K).
Next, let's look at the ceramic substrate.
Ceramic substrate - refers to the copper foil directly bonded to the surface of alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate (single or double-sided) at high temperature. The ultra-thin composite substrate has excellent electrical insulation performance, high thermal conductivity, excellent solderability and high adhesion strength, and can etch all kinds of patterns like PCB board, so it has great current carrying capacity.
Ceramic circuit boards have the following characteristics:
_Strong mechanical stress, shape stability; High strength, high thermal conductivity, high insulation; Strong adhesion, anti-corrosion.
Excellent thermal cycling performance, 50 thousand cycles and high reliability.
The same as PCB board (or IMS substrate), it can etch out all kinds of graphic structure, pollution-free and pollution-free.
_Use temperature wide - 55 ~850, thermal expansion coefficient close to silicon, simplify the power module production process. It can save Mo slice of transition layer, save labor, save material and reduce cost.
Reduce welding layer, reduce heat resistance, reduce cavity and increase yield.
Under the same current carrying capacity, the width of 0.3mm thick copper foil is only 10% of that of ordinary printed circuit boards.
_Excellent thermal conductivity makes the package of the chip very compact, which greatly improves the power density and the reliability of the system and device.
Ultrathin (0.25mm) ceramic substrate can replace BeO without environmental toxicity.
_Large current carrying capacity, 100A current continuously through 1 mm wide 0.3 mm thick copper body, temperature rise about 17, 100A current continuously through 2 mm wide 0.3 mm thick copper body, temperature rise only about 5;
_Thermal resistance is low, thermal resistance of ceramic substrate with thickness of 0.63mm is 0.31K/W, thermal resistance of ceramic substrate with thickness of 0.38mm is 0.19K/W, thermal resistance of ceramic substrate with thickness of 0.25mm is 0.14K/W.
Insulation high voltage, to ensure personal safety and equipment protection capabilities.
It can realize new encapsulation and assembly methods, make products highly integrated and reduce volume.
AIN ceramic plate has super high thermal conductivity, theoretical thermal conductivity at room temperature is 319W / (m K), and good insulation, resistivity is greater than 1014_ cm at 25 C.
With the advent of ceramic substrate products and the opening of the development of heat dissipation application industry, due to the characteristics of ceramic substrate heat dissipation, coupled with ceramic substrate with high heat dissipation, low thermal resistance, long life, voltage resistance and other advantages, with the improvement of production technology and equipment, product prices accelerated rationalization, thereby expanding the application of LED industry, such as household appliances. Product indicators, car lights, street lights and outdoor large kanban. Successful development of ceramic substrate will become more indoor lighting and outdoor lighting products to provide services, so that the LED industry in the future market more broad areas.
After comparison, we believe that we have a certain understanding of the two materials of the substrate, with the update of technology iteration, new and better products will replace the old technology, the market has always been the survival of the fittest, as producers, should be benign competition, so that their products become better and better, so as to drive the industry as a whole. Progress and take-off.
Now chip manufacturing is varied, and LED chips are no exception. The thermal conductivity of the chip will directly affect the heat dissipation, of course, as a chip can not only look at the heat dissipation, but also dielectric constant, thermal expansion coefficient and so on. Today, a wide range of aluminum substrates and low-lying ceramic substrates are widely used in the market.
Aluminum substrates - commonly used in LED lighting products. There are positive and negative sides, the white side is welded LED pins, the other side presents the aluminum color, will generally be coated with heat conduction slurry after contact with the heat conduction part.
Aluminum substrate commonly used metal aluminum-based sheets are mainly 1000 series, 5000 Series and 6000 series, the basic characteristics of these three series of aluminum are as follows:
1, 1000 series represents 1050, 1060, 1070, 1000 series of aluminum plates, also known as pure aluminum plate, in all series of 1000 series belong to the most aluminum content, purity can reach 99.00%. Because it does not contain other technical elements, so the production process is relatively simple, relatively cheap, is the most commonly used in conventional industry in a series.
The 2 and 5000 Series represent 5052, 5005, 5083 and 5A05 series. The 5000 series aluminum sheets belong to the more commonly used series of alloy aluminum sheets, the main element is magnesium, magnesium content is between 3-5%, which is also known as aluminum magnesium alloy. The main features are low density, high tensile strength and high elongation. Aluminum-magnesium alloys are often used in aviation, such as aircraft fuel tanks, because they weigh less than other series in the same area.
Series 3 and 6000 represent 6061, which mainly contains magnesium and silicon. Therefore, Series 4000 and Series 5000 have the advantages that 6061 is a cold-treated aluminum forging product. It is suitable for the application of high corrosion resistance and oxidation resistance. It has good usability, excellent interface features, easy coating and good processability.
The thermal conductivity of 5000 series aluminum substrate is about 135W / (m K), 6000 series aluminum substrate is about 150W / (m K) and 1000 series aluminum substrate is about 220W / (m K).
Next, let's look at the ceramic substrate.
Ceramic substrate - refers to the copper foil directly bonded to the surface of alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate (single or double-sided) at high temperature. The ultra-thin composite substrate has excellent electrical insulation performance, high thermal conductivity, excellent solderability and high adhesion strength, and can etch all kinds of patterns like PCB board, so it has great current carrying capacity.
Ceramic circuit boards have the following characteristics:
_Strong mechanical stress, shape stability; High strength, high thermal conductivity, high insulation; Strong adhesion, anti-corrosion.
Excellent thermal cycling performance, 50 thousand cycles and high reliability.
The same as PCB board (or IMS substrate), it can etch out all kinds of graphic structure, pollution-free and pollution-free.
_Use temperature wide - 55 ~850, thermal expansion coefficient close to silicon, simplify the power module production process. It can save Mo slice of transition layer, save labor, save material and reduce cost.
Reduce welding layer, reduce heat resistance, reduce cavity and increase yield.
Under the same current carrying capacity, the width of 0.3mm thick copper foil is only 10% of that of ordinary printed circuit boards.
_Excellent thermal conductivity makes the package of the chip very compact, which greatly improves the power density and the reliability of the system and device.
Ultrathin (0.25mm) ceramic substrate can replace BeO without environmental toxicity.
_Large current carrying capacity, 100A current continuously through 1 mm wide 0.3 mm thick copper body, temperature rise about 17, 100A current continuously through 2 mm wide 0.3 mm thick copper body, temperature rise only about 5;
_Thermal resistance is low, thermal resistance of ceramic substrate with thickness of 0.63mm is 0.31K/W, thermal resistance of ceramic substrate with thickness of 0.38mm is 0.19K/W, thermal resistance of ceramic substrate with thickness of 0.25mm is 0.14K/W.
Insulation high voltage, to ensure personal safety and equipment protection capabilities.
It can realize new encapsulation and assembly methods, make products highly integrated and reduce volume.
AIN ceramic plate has super high thermal conductivity, theoretical thermal conductivity at room temperature is 319W / (m K), and good insulation, resistivity is greater than 1014_ cm at 25 C.
With the advent of ceramic substrate products and the opening of the development of heat dissipation application industry, due to the characteristics of ceramic substrate heat dissipation, coupled with ceramic substrate with high heat dissipation, low thermal resistance, long life, voltage resistance and other advantages, with the improvement of production technology and equipment, product prices accelerated rationalization, thereby expanding the application of LED industry, such as household appliances. Product indicators, car lights, street lights and outdoor large kanban. Successful development of ceramic substrate will become more indoor lighting and outdoor lighting products to provide services, so that the LED industry in the future market more broad areas.
After comparison, we believe that we have a certain understanding of the two materials of the substrate, with the update of technology iteration, new and better products will replace the old technology, the market has always been the survival of the fittest, as producers, should be benign competition, so that their products become better and better, so as to drive the industry as a whole. Progress and take-off.
